Our goal is to meet and exceed the expectations of our customers. PAC is a quality conscious organization, religiously adhering to the principles of Quality Management System. Management is totally dedicated to the quality policy and organizational quality objectives and ensures that quality philosophy is understood by every employee through training and open communication.
All work is done under the guidelines of IPC standards and our assembly work is guaranteed. Upon receipt of notifi cation, any correction that has to be made is completed along with documentation to correct the process and its implementation is ensured. PAC adheres to IPC A-610 standards to inspect all assemblies. We use visual inspection, magnifi er lamps, and high resolution microscopes and 3-D X-ray inspection equipment to complete fi nal quality control inspections.
Optical and X-Ray Inspection
PAC can perform the optical and 3D X-ray inspection of the product assembly upon the customer request and its reports can be sent with the product for Quality assurance to our valuable customer. These inspections reports are very useful if the product assembly contains BGAs and some fi ne pitch QFPs. X-ray inspection can be performed for electronic PCBs up to size of 400 x 400 mm (16 inch x 16 inch). It is useful in determining BGA and micro BGA faults like short circuited balls, over and under sized balls, solder voids and quality of balls. It can also identify broken connections inside the ICs.
Design, Development and Deletion (DDD) Group is established with highly skilled engineers and technicians who are involved in design and development of avionics equipment. The core competencies include:
- Embedded Systems Design
- Panel and Chassis Development
- Rapid PCB Prototyping
Embedded System Design (ESD)
With the rapid advancement in solid-state electronics, the power of embedded systems has risen exponentially. Embedded systems design department specializes in delivering custom embedded-systems based solutions. A stage-wise development process is followed starting from feasibility study to virtual and physical prototyping. Since embedded systems are technology-independent, most appropriate technological alternatives are sought in order to achieve customer satisfaction using the latest and emerging technologies. The group provides a wide spectrum of applications and hardware solutions relying heavily on innovation, creativity and cutting-edge technologies. Our expertise includes:
- Embedded processors
- Micro Controllers
- Micro Processors
- Xilinx based FPGA's
- Simulation system design based on following software:
- Lab Windows
We can provide services related to:
- Custom peripheral-card design
- Product concept and specifi cation development
- Electronic hardware design and implementation
- Embedded fi rmware design and implementation
- Logic Integration
- Re-designing for cost reduction, manufacturing or test enhancement
- Design of test fi xtures, test software and diagnostics
Panel and Chassis Development
Working with the vision of providing AutoCAD design and MIL SPEC product qualifi cation services, DDD has carved a special niche for itself in the arena of specialized mechanical engineering services. Backed by a strong team of dynamic and passionate professionals, DDD serves as a distinguished service provider catering to the designing, manufacturing and sourcing needs of diverse sectors. Our key areas include CAD design modeling, NVIS Compatible Display Panels, MIL SPEC Chassis design.
Rapid PCB Prototyping (RPP)
The primary objective of the RPP department is to accelerate the process from concept to real product. The complexity and extremely dense nature of the electronic design today dictates a highly compact form for the product. This in-house facility aims at understanding the electrical, mechanical and stringent compliance requirements of a design followed by the production of prototypes. Following the Design-for-Manufacturability (DFM) methodology, this group plays a vital role in the industrialization of the concept while maintaining conformance to all the relevant standards. The group also undertakes projects where PCB’s need to be reverse-engineered for modules no more supported by OEM. The quality assurance program ensures that the layout design is of the highest standard and is 100% manual routing so that the design refi nement starts even before the fi rst iteration. The facilities included are:
- Schematic design generation using Orcad Capture
- PCB layout design based on Orcad Layout in adherence to DFM
- Gerber review for manufacturing using Circuit Cam
- Production of up to 6-layered PCB prototypes
- Design review in conjunction with the project engineers